High-Density Multilayer PCB Assembly

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High-Density Multilayer PCB Assembly

Product Description

Our PCB capability:

Material used: FR4, High Tg Minimum 170C, Hifrequency, Metal based: Aluminium ect.

Maximum Panel Size: 26" X 26" (660mm X 660mm)

Line Width & Spacing:

Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples

Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Layer Count & Thickness: 2-12 layers

Minimum Thickness (2 Layers): 4 mil (0.1 mm)

Minimum Thickness (4 Layers): 12 mil (0.3 mm)

Minimum Thickness (6 Layers): 16 mil (0.4 mm)

Minimum Thickness (8 Layers): 24 mil (0.6 mm)

Maximum Thickness(10layers): 200 mil (5.0 mm)

Layer to Layer Registration: +/- 5 mil (0.13 mm)

Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)

Minimum Via Size: 8 mil (0.2 mm)

Hole to Hole Tolerance: +/- 3 mil (0.08 mm)

Hole to Edge Tolerance: +/- 5 mil (0.13 mm)

Micro Via: 4 mil (0.1 mm)

Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)

Warpage: 0.5 %

Impedance: +/- 10%

Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin

Min. SMT Ptich: 12 mil (0.2 mm)

Min. Parts footpins: 0201

Products involved fields: Consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.

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