Cope of products: Single-side FPC, double-side FPC, multilayer FPC, aluminum substrate, copper substrate, single-side hollowed-out FPC and double-side hollowed-out FPC
Thinnest substrate: Copper foil/PI film: 18/12.5 um
Smallest wire width and distance: 0.05mm/0.05mm (2mil/2mil)
Smallest aperture: 0.20mm (8mil)
Resistance to flexural cracking: > 150, 000 cycles
Etching tolerance: + - 0.25 mil
Tolerance for exposure and alignment: + - 0.05mm (2mil)
Tolerance for projection punching: + - 0.025mm (1mil)
Tolerance for PI film alignment: < 0.10mm (4mil)
Tolerance for reinforcing and take alignment: < 0.1mm (4mil)
Maximum processing area: 25cm * 50cm for double side; 25 cm * 10000cm for single side; 25cm * 25cm for multilayer
Forming tolerance: + - 0.05mm
ROLL to ROLL process
Mode of surface treatment:
Electroplated guiding
Chemical gilding
Pure electroplating tine
Chemical tin
Antioxidation